[{"data":1,"prerenderedAt":-1},["ShallowReactive",2],{"brand-shenghejingwei":3},{"head":4,"company":39,"invest":44,"children":45,"shops":46,"category":47,"sameIndustry":5,"rid":6},{"createTime":5,"updateTime":5,"createBy":5,"updateBy":5,"brandId":6,"brandLogo":7,"brandImage":5,"brandName":8,"webName":9,"balias":5,"enterId":10,"mainindustry":11,"industry":5,"brandType":5,"brandHonor":5,"brandTel":12,"establishdate":13,"brandBirth":14,"cityarea":5,"brandWebsite":5,"brandSobp":5,"brandVisit":5,"totalVisits":15,"status":16,"isDeleted":16,"comment":5,"remark":5,"logoExistStatus":17,"imageExistStatus":17,"industryId":5,"industryRanking":5,"score":5,"enterName":18,"mallShopList":19,"brandSummary":5,"likes":5,"unlikes":5,"follow":5,"pagetitle":20,"pagekeywords":21,"pagedesc":22,"brandContent":23,"province":5,"city":5,"area":5,"detailaddress":24,"unifiedscc":25,"enterType":26,"enterLegalperson":27,"enterStablishdate":28,"regauthority":29,"licenseValidity":30,"approvaldate":31,"regcapital":32,"incapital":33,"businessscope":34,"ownBrand":5,"enterTelphone":35,"enterWebsite":36,"business":37,"enterQq":5,"enterMail":38,"bindUser":5,"enterMployeenum":5,"regcapitalunit":5,"abnormal":5,"yeartax":5,"regtrademark":5},null,"1636333","\u002Fprofile\u002Fupload\u002F2023\u002F12\u002F02\u002F77f413c039a34285248108ad1efe607d.gif","盛合晶微","shenghejingwei",164623,10380,"0510-86088168","2014年","江阴",328,0,"1","盛合晶微半导体（江阴）有限公司",[],"盛合晶微品牌介绍-盛合晶微芯片封装_芯片-品牌之家","盛合晶微,盛合晶微怎么样,盛合晶微官网,盛合晶微芯片封装,盛合晶微芯片","品牌之家提供盛合晶微半导体(江阴)有限公司旗下盛合晶微品牌相关信息，包括盛合晶微品牌介绍、联系方式、主营产品、最新评论、点赞数量等，告诉你盛合晶微怎么样、盛合晶微好不好，致力于提供有价值的品牌资料，是你了解盛合晶微品牌资料的参考网站。","盛合晶微半导体有限公司原名中芯长电半导体有限公司，于2014年8月注册成立，是采用集成电路前段芯片制造体系和标准，采用独立代工模式服务全球客户的中段硅片制造企业。\n\n公司坚持和谐发展、合作共赢，通过与产业链伙伴的多方位合作，提供智能、绿色、生态的产品加工和服务；同时强调环保安全卫生、爱护人力资源、珍惜自然资源。盛合晶微的每一位员工都是环保安全卫生的主人翁，通过持续改善的活动，使公司业务、产业生态、社会环境、自然生态的可持续发展。\n\n以先进的12英寸凸块和再布线加工起步，公司致力于提供世界一流的中段硅片制造和测试服务，并进一步发展先进的三维系统集成芯片业务。公司总部位于中国江阴高新技术产业开发区，在上海和美国硅谷设有分支机构，服务于国内外先进的芯片设计企业。","江阴市东盛西路9号","91320281321666575D","有限责任公司(港澳台法人独资)","崔东","2014-11-25","江阴市市场监督管理局","-","2025-03-13","151,000万(美元)","117,000万(美元)","集成电路设计，线宽28纳米及以下大规模数字集成电路制造，0.11微米及以下模拟、数模集成电路制造，MEMS和化合物半导体集成电路制造及BGA、PGA、CSP、MCM等先进封装与测试。（依法须经批准的项目，经相关部门批准后方可开展经营活动）","0510-86976820","www.sjsemi.com","计算机、通信和其他电子设备制造业","xiaoronghu@sjsemi.com",{"enterId":40,"enterName":18,"province":5,"city":5,"area":5,"detailaddress":24,"unifiedscc":25,"enterType":26,"enterLegalperson":27,"enterStablishdate":28,"regauthority":29,"licenseValidity":30,"approvaldate":31,"regcapital":32,"incapital":33,"businessscope":34,"ownBrand":5,"enterTelphone":35,"enterWebsite":36,"business":37,"performance":41,"socialSecurity":42,"registrationNumber":43,"enterQq":5,"enterMail":38,"bindUser":5,"enterMployeenum":5,"regcapitalunit":5,"abnormal":5,"yeartax":5,"status":16,"regtrademark":5,"remark":5},"164623","开业","4243人","320281400014228",{"createTime":5,"updateTime":5,"createBy":5,"updateBy":5,"id":5,"brandId":5,"brandName":5,"busmodel":5,"franchiseFund":5,"totalStores":5,"devmodel":5,"franchiseIndustry":5,"investmenttel":5,"suitablePeople":5,"state":5},[],[],[48,66],{"createTime":49,"updateTime":50,"createBy":5,"updateBy":5,"industryId":51,"webId":5,"industryName":52,"industryAlias":53,"industryIcon":5,"industryTrans":54,"pageTitle":55,"pageDesc":56,"pageKeywords":57,"mainTitle":58,"pageSubtitle":59,"indSummary":60,"industryLevel":61,"parentId":62,"parentName":63,"sortOrder":64,"status":16,"classifyVisit":5,"totalVisits":65,"searchName":5,"starLevel":5,"limit":5},"2000-01-01 00:00:00","2026-06-16 16:50:00","2340","芯片","芯片,半导体芯片,显卡芯片,IC芯片,CPU芯片,存储芯片,电脑芯片,手机芯片,集成电路设计企业,芯片设计公司,集成电路,中央处理器,处理器,CPU,cpu","\u002Fprofile\u002Fupload\u002F2023\u002F11\u002F08\u002F88d3c1c2df30f47d61060d1ea73f2687.png","芯片品牌排行榜-集成电路品牌-全球十大芯片公司排名-品牌之家排行榜","2026年芯片十大品牌，是由品牌之家数据研究部门通过收集整理芯片行业品牌大数据分析研究得出，由品牌之家发布的十大芯片品牌排行榜，旨在褒扬芯片品牌，展现行业优秀企业，是你了解芯片哪个牌子好的品牌参考网站。","芯片龙头股排名前十,芯片排行,芯片品牌排行榜前十名,芯片十大公司,十大半导体芯片品牌","芯片品牌排行榜","2026年十大芯片设计企业，半导体芯片-集成电路设计企业排行，IC芯片设计有哪些","芯片什么牌子好？经品牌之家研究院专业评测，正式发布2026年芯片十大品牌与热门品牌名单；前十名分别有：Intel英特尔、NVIDIA英伟达、SAMSUNG三星、Qualcomm高通、海思Hisilicon、联发科Mediatek、AMD、SKHynix海力士、Broadcom博通、TI德州仪器等，上榜芯片十大品牌榜单和著名芯片品牌名单的是企业实力强，市场销量高有口碑、有知名度的品牌，排名不分先后，仅供借鉴参考，想知道什么牌子的芯片好？通过大数据统计、GTP4分析、人工智能解答、为您提供真实客观公正，绝不收费的排行榜。芯片品牌主要属于商标分类的第9类（0901、0910、0913）、第42类（4220）。",3,26,"电脑\u002F硬件",13,87666,{"createTime":49,"updateTime":50,"createBy":5,"updateBy":5,"industryId":67,"webId":5,"industryName":68,"industryAlias":5,"industryIcon":5,"industryTrans":69,"pageTitle":70,"pageDesc":71,"pageKeywords":72,"mainTitle":73,"pageSubtitle":74,"indSummary":75,"industryLevel":61,"parentId":76,"parentName":5,"sortOrder":77,"status":16,"classifyVisit":5,"totalVisits":78,"searchName":5,"starLevel":5,"limit":5},"10380","芯片封装","\u002Fprofile\u002Fupload\u002F2023\u002F11\u002F08\u002F371fb87c4eb9609ca41c22b5fa486c2f.jpeg","十大芯片封装企业-芯片封装公司有哪些-芯片封装厂商有哪些-ZGALL品牌榜","2026年芯片封装行业十大品牌权威发布！芯片封装排行榜前十名品牌有日月光、安靠、长电、通富微电、华天、力成、京元电子、WLCSP、日月新、UTAC。芯片封装10大品牌排行榜由品牌研究部门收集整理大数据分析、研究得出，帮助你了解芯片封装哪个牌子好。","芯片封装公司排名,业界主流的芯片封装厂,十大芯片封装公司排名,十大芯片封装品牌,中国十大芯片封装公司","芯片封装品牌排行榜","2026芯片封装企业排行榜，半导体封测-封测代工厂，集成电路封装测试企业有哪些","芯片封装哪个好？品牌TOP榜权威发布2026年芯片封装名录；居前十的有：日月光、AMKOR安靠、长电科技JCET、通富微电、华天科技HUATIAN、力成Powertech Technology、京元电子KYEC、WLCSP、日月新ATX、UTAC等，【行业品牌名录】基于大数据与人工智能技术，整合300+国际权威榜单及企业申报数据，通过算法分析市场占有率、创新力等12项指标，并解析超百万条舆情信息，采用加权模型（算法60%+专家30%+用户10%）生成动态排名。数据月度更新，申报需通过ISO认证审核，排名不分先后，仅供参考。",4965,99,717]